Wong / Mittal / Starr Nano-CMOS Design for Manufacturability

Robust Circuit and Physical Design for Sub-65nm Technology Nodes
1. Auflage 2009
ISBN: 978-0-470-38281-3
Verlag: John Wiley & Sons
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 408 Seiten, E-Book

Discover innovative tools that pave the way from circuit andphysical design to fabrication processing
Nano-CMOS Design for Manufacturability examines the challengesthat design engineers face in the nano-scaled era, such asexacerbated effects and the proven design for manufacturability(DFM) methodology in the midst of increasing variability and designprocess interactions. In addition to discussing the difficultiesbrought on by the continued dimensional scaling in conformance withMoore's law, the authors also tackle complex issues in the designprocess to overcome the difficulties, including the use of afunctional first silicon to support a predictable product ramp.Moreover, they introduce several emerging concepts, includingstress proximity effects, contour-based extraction, and designprocess interactions.
This book is the sequel to Nano-CMOS Circuit and PhysicalDesign, taking design to technology nodes beyond 65nm geometries.It is divided into three parts:
* Part One, Newly Exacerbated Effects, introduces the newlyexacerbated effects that require designers' attention, beginningwith a discussion of the lithography aspects of DFM, followed bythe impact of layout on transistor performance
* Part Two, Design Solutions, examines how to mitigate the impactof process effects, discussing the methodology needed to makesub-wavelength patterning technology work in manufacturing, as wellas design solutions to deal with signal, power integrity, WELL,stress proximity effects, and process variability
* Part Three, The Road to DFM, describes new tools needed tosupport DFM efforts, including an auto-correction tool capable offixing the layout of cells with multiple optimization goals,followed by a look ahead into the future of DFM
Throughout the book, real-world examples simplify complexconcepts, helping readers see how they can successfully handleprojects on Nano-CMOS nodes. It provides a bridge that allowsengineers to go from physical and circuit design to fabricationprocessing and, in short, make designs that are not onlyfunctional, but that also meet power and performance goals withinthe design schedule.

Autoren/Hrsg.

Wong, Ban P.

Mittal, Anurag

Starr, Greg W.

Zach, Franz

Moroz, Victor

Kahng, Andrew

Inhaltsverzeichnis

1. Introduction.
1.1 DFM - Value proposition.
1.2 Deficiencies in Boolean-based Design Rules in thesub-wavelength regime [6].
1.3 Impact of Variability on Yield and Performance.
1.4 The industry challenge - disappearing process window.
1.5 Mobility enhancement techniques - a new source ofvariability induced by design process interaction.
1.6 Design dependency of chip surface topology.
1.7 Newly exacerbated narrow width effect in nano-CMOSnodes.
1.8 Well proximity effect.
1.9 Scaling beyond 65nm drives the need for model based DFMsolutions.
1.10 Summary.
PART 1: NEWLY EXACERBATED EFFECTS.
2. Lithography related Aspects of DFM.
2.1 Economic motivations for DFM.
2.2 Lithographic tools and techniques for advanced technologynodes.
2.3 Lithography limited yield.
2.4 Lithography driven DFM Solutions.
3. Interaction of layout with transistor performance andstress engineering techniques.
3.1 Introduction.
3.2 Impact of stress on transistor performance.
3.3 Stress propagation.
3.4 Stress sources.
3.5 Introducing stress into transistors.
PART 2: DESIGN SOLUTIONS.
4. Signal and Power Integrity.
4.1 Introduction.
4.2 Interconnect Resistance, Capacitance and Inductance.
4.3 Inductance Effects on Interconnect.
5. Analog and Mixed Signal Circuit Design for Yield andManufacturability.
5.1 Introduction.
5.2 Guidelines.
5.3 Device Selection.
5.4 Device Size Heart Beat.
5.5 Device Matching.
5.6 Design Guidelines.
5.7 Layout Guidelines.
5.8 Test.
6. Design for Variability, Performance and Yield.
6.1 Introduction.
6.2 Impact of variations (introduced by both process and circuitoperation) on the design.
6.3 Some Parametric Fluctuations with new implications fordesign .
6.4 Process Variations in Interconnects.
6.5 Impact of Deep Sub-Micron Integration in SRAMs.
6.6 Impact of Layout Styles on Manufacturability, Yield andScalability.
6.7 Design for variations.
6.8 Summary.
PART 3: THE ROAD TO DFM.
7. Nano-CMOS design tools: Beyond model-based analysis andcorrection.
7.1 Introduction.
7.2 Electrical Design for Manufacturability (DFM).
7.3 Criticality Aware DFM.
7.4 On Guardbands, Statistics, and Gaps.
7.5 Opportunistic Mindsets.
7.6 Futures at ó 45nm .
7.7 Summary.
7.8 References.

Über Autor(innen)

Ban P. Wong, CEng, MIET, is Director of Design Methodology atChartered Semiconductor, Inc. He holds five patents and is the leadauthor of Nano-CMOS Circuit and Physical Design (Wiley).
Franz Zach, PhD, is Senior Director at PDF Solutions, where heis involved in integrated yield ramps at advanced technologynodes.
Victor Moroz, PhD, is a Principal Engineer at Synopsys. Hefocuses on semiconductor physics, including silicon processintegration, teaching undergraduate and graduate students, anddeveloping process simulation and DFM tools.
Anurag Mittal, PhD, Yale University, has co-developed theworld's first truly CMOS-compatible Flash technology. He hasseveral papers, invited talks, and patents to his credit. Currentlyhe is Director of Technology & Applications at Takumi Inc.,where he is developing novel EDA solutions on Design forVariability & Reliability.
Greg W. Starr, PhD, is a Supervising Principal Engineer atXilinx, where he is responsible for advanced serial IO developmenton advanced processes.
Andrew Kahng, PhD, is Professor of CSE and ECE at the Universityof California, San Diego, and the CTO of Blaze DFM. His researchfocuses on integrated circuit physical design and design formanufacturability. Dr. Kahng has published more than 300 journaland conference papers.