Zhang Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

1. Auflage 2016
ISBN: 978-3-662-48823-2
Verlag: Springer
Format: PDF
Kopierschutz: Wasserzeichen (»Systemvoraussetzungen)

E-Book, Englisch, 153 Seiten, eBook

Reihe: Springer Theses

This thesis
presents a series of mechanical test methods and comprehensively investigates
the deformation and damage behavior of Cu/Pb-free solder joints under different
loading conditions. The fracture behavior of Pb-free joint interfaces induced
by stress, deformation of solder and substrate are shown, the shear fracture
strength of the Cu6Sn5 IMC is measured experimentally for the first time, and
the dynamic damage process and microstructure evolution behavior of Pb-free
solder joints are revealed intuitively. The thesis puts forward the argument
that the local cumulative damage is the major cause of failure in solder
joints. The research results provide the experimental and theoretical basis for
improving the reliability of solder joints.

Zielgruppe

Research

Autoren/Hrsg.

Zhang, Qingke

Inhaltsverzeichnis

Research Progress in Pb-free Soldering.- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface.- Tensile-compress Fatigue Behavior of Solder Joints.- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints.- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints.- Conclusions.